PORESPHERE® Liquid Silica for Electronic Components

Suspension-based silicon dioxide
Silica gel / silicon dioxide / silica gel / silicic acid

Weight: 1250 kg (IBC drum)
Resealable

Additive for compaction compounds in circuit boards and printed circuit boards
Appearance and form: Liquid, transparent
pH value: 9.23
Viscosity: 41.2 mPa.s (25°C)
Density: 1.388 g/cm3 (25°C)
Fe3+: 15 ppm
Cu2+: 146 ppb
Al3+: 63 ppm
Average particle size: 29.48 nm
CAS No.: 7631-86-9
EC No.: 231-545-4
Country of origin: PRC
Customs tariff code: 28112200

Composition: 50.6% silicon dioxide SiO₂ 0.12% sodium oxide Na₂O